Smart and high end BGA Rework Station KID-R750

Model:	KID-R750
Brand:	KIDI
Origin:	Made In China
Category:	Industrial Supplies / Machinery / Welding Machinery
Label:	BGA rework station , bga repair machine , bga repair system
Price:	-
Min. Order:	1 pc

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Product Description

Intelligent High-end BGA Rework Station KID-R750
--Bottom germany imported glass and glazed tube heating, temperature rise and drop very quickly
--optics camera automatically move in x and y axises
--lower heater can automatically go up to support the pcb boards

1. Product profile

KID-R750 is a small-sized rework station but can desolder and solder Max. PCB size 630x630mm; with optical alignment system and hot air & IR mixing heating way; controlled by software.

2. Features

² Hot air head and mounting head integration design, with auto soldering and desoldering functions.

² Upper/lower heaters adopt Hot air & IR mix heating. Upper heater uses two-path and direct-injection way. IR acts on the heating area directly; in the meanwhile, hot air works. They interact to heat quickly, and keep temperature even. (heating-up speed is up to 10°C/S)

² Independent 3 heaters, upper and lower heaters can realize linkage and move within bottom pre-heating area along X/Y axis. Lower heater can move up/down and support PCB, auto-controlled by motors. the upper and lower heater able to move towards target BGA, without moving PCB.

² Unique bottom preheating table made of Germany-imported good quality heating materials “plated IR tube” & constant temperature glass “anti-dazzle” (heat-resist up to 1800°C), pre-heating area up to 500*420mm.

² Preheating table, clamping device and cooling system can move integrally in X axis that make PCB locating & desoldering safer and conveniently.

² The unique design of integral movement in X/Y axis, make the best of space.; Small-sized device accomplishes big PCB rework needs ; Max. PCB size up to 630*610mm; no rework dead space.

² Inbuilt vacuum pump, rotatable 360° in Φ angel; fine-adjusting mounting suction nozzle.

² Suction nozzle can detect BGA pickup and mounting height automatically with pressure controllable within 10 grams; “zero” pressure available to smaller BGA pickup and mounting.

² Color high-resolution optical vision system, movable by hand in X/Y axis, with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom; reworkable max. BGA size 70*70MM;

² Embedded industrial computer, touch screen interface, PLC control with real-time temperature profile display; both setting profile and real temperature profile can be displayed；

² Upper/lower heater with 10 segments of temperature up (down) and 10 segments of constant temperature control, industrial computer can save temperature profiles without limit; can analysis profiles on the touch screen.

² Many sizes of alloy nozzle, easy for replacement; can locate at all angle.

² With 5 thermocouple ports, can real-time detect and analyze temperatures at multipoint.

² Equipped with two independent air supply, can connect with Nitrogen or compressor air, or interchange them, makes desoldering safer and more reliable
Upgraded function
1. Can keep longtime 30°C difference between the heating area and border area to protect small BGA around from melting; special for the glued BGAs of cell phone and laptop.
2. with the additional function of suction nozzle rotatable in 360°; controlled by step motor and the rotating angles can be memorized.
3. with the additional function of suction nozzle rotatable in 360°, controlled by step motor and the rotating angles can be memorized; Optical alignment controlled by remote control motor; With auto-memory for BGA pickup & place and alignment; It can observe BGA four corners automatically.