Good-quality automatic BGA Repair System KID-R600;your best choice for Xbox, PS3, laptop repair, etc.

IR&hot air mixing heating, 3 heaters
Unique Auto Profile
Large and movable bottom IR preahting, universal for mobile phone boards, laptop, pc, game consoles, etc
Automatic touch screen control with high-resolution LCD monitor display of images


1        Product profile

             KID-R600 is a rework station with optical alignment system, and the integration of soldering and desoldering design; applicable to BGAs of all forms of encapsulation.

 

         2        Features

²    Hot air head and mounting head integration design, step motor drive, with auto soldering and desoldering functions.

²    New-style hot air and IR mixed 2 in 1 for upper head heating; temperature rises fast,   which leads to the big temperature difference between BGA and others  around with no effects on them; suitable for PCB with small pitch between components.

²    Three separate heating areas, upper/lower hot air and bottom IR; heating time and temperature can display on the touch screen.

²    Large movable bottom pre-heating area, PCB clamping device can be flexibly adjusted on X/Y-axis; reworkable Max. PCB size 550*550mm.

²    Powerful cross flow fan cools down the lower heating areas quickly.

²    Color high-resolution optical vision system with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom, reworkable BGA size range 1.5 * 1.5 mm ~70*70mm.

²    Embedded industrial computer, touch screen interface, PLC control with real-time temperature profile display; both setting profile and real temperature profile can be displayed；

²    Inbuilt vacuum pump, rotatable 60° in Φ angle, fine-adjusting mounting suction nozzle.

²    Upper/lower heater with 8 segments of temperature up (down) and 8 segments of constant temperature control, industrial computer can save temperature profiles without limit; can analysis profiles on the touch screen. 

²    Suction nozzle can detect mounting height automatically with pressure controllable within tiny extent.

²    Many sizes of alloy nozzle, easy for replacement; can locate at all angle.

²    Color optical vision system manually operated.

²    Auto-place BGA chips on jigs with locating scales.

²    Equipped with thermocouple port, real-time temperature monitoring and analyzing functions.

 

3         Technical parameter

l        Model No : KID-R600

l        Max PCB size: L550*W500mm

l        PCB thickness:  0.5~5mm

l        Applicable BGA:  1*1~70*70mm

l        Min.ball pitch: 0.15mm

l        Max. weight of BGA: 150g

l        Placement accuracy:  ±0.01mm

l        PCB locating way: Outer

l        Working table adjustable: forward/backward ±15mm, left/right ±15mm

l        Temperature control way: K-type thermocouple, close loop control

l        Lower hot heater: hot air 800W

l        Upper hot heater: IR+ hot air 1200W

l        Bottom pre-heating: IR 3600W

l        Power: Single-phase 220V、50/60Hz

l        Machine size: L850*W750*H630mm

l        Machine weight: approx. 80KGS