Application：
Combined  with  Liquid  Epoxy  Resin,  suitable  for  Epoxy  embedding  material,  Casting
material,Encapsulating  material,  Coating  Material,  and  Adhesive.  To  be  used  in
non-solvent unticorrosion coating, widing-forming.
Application features: Low viscosity, can greatly lower the viscosity of epoxy resin, improve
the tenacity and adhesion of cured epoxy resin, good solubility with various epoxy resins.