Application: 
widely used in wet chemical process of chip in  IC production and semiconductor components production;

Utility:

the device can effectively remove organic pollutants, the wafer surface particles, metal impurities,the natural oxide layer and quartz, plastic and other accessory vessels, and not destory  the wafer surface characteristics ;

Functional groove includes:
heating acid cylinder, HF corrosion, BHF (HF constant temperature buffercorrosion), ultrasonic cleaning tank, constant temperature water bath, QDR (fast row flushing), electric furnace etc..
Automatic wafer cleaning equipment features: 
imported servo driving mechanism and a mechanical arm, without manual operation in the process of cleaning. It is controlled by PLC, all the operation through the touch screen interface once completed. Can be pre arranged a plurality of cleaning process, can run multiple processes at the same time. A high degree of automation, suitable for mass production, to ensure the consistency of the cleaning quality. Automatic nitrogen bubbling device can effectively improve the quality of products, shorten the cleaning time. Optional laminar flow purifying system and automatic mixing acid device