Item specifics

is_customized:

Yes

Brand Name:

SIREDA

Model Number:

705-0000340

Package:

BGA

Pitch:

0.5mm

Pin Count:

221

IC Size:

11.5X13mm

Product Description

BGA221(eMMC) Reball Kit_11.5X13mm, BGA Reballing Station

Aluminum alloy structure, lightweight and durable structure

Precision IC guide, accurate positioning.

Steel Dimensions: (80 x 80) mm, apply to BGA 221, size: 11.5X13mm

The unique tin ball storage room design, no need to poure out excess solder ball every time, make production more efficiency.

For more other BGA Reballing Kit, please contact our sales man.

 

Sireda Technology also provides Rework Solution. We have much experience in BGA Reballing, especially in POP Reballing. High yield rate guaranted.

 

Packaging Details

Unit Type:

piece

Package Weight:

0.500kg (1.10lb.)

Package Size:

12cm x 11cm x 9cm (4.72in x 4.33in x 3.54in)