Item specifics
Model Number:
702-0000218
Brand Name:
SIREDA
is_customized:
Yes
Package:
BGA
Pitch:
1.0mm
Pin Count:
153
IC Size:
Structure:
Contact:
Spring Probe
Product Description
The F solution designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc. For devices with more than 256 pins, please look for our “U” solution.
- Test, debug, validation of devices of BGA,LGA,QFP,QFN,SOP,etc
- Pitch from 0.4mm to 1.27mm
- "Buy and use" modular design
- Standardized design shorten lead time
- F solution is designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc.
- The compact, surface mount design requires no tooling, no extra place or mounting holes in the target PC board, maximizing real estate while reducing board costs.
- Precision machined spring probes with industry proven solder balls ensure high reliability performance, easy of maintenance and reduced testing downtime.
- Fully removable double latch turning lid makes it can be used for both manual and automatic operation, and enable quick device insertion and extraction.
- Avoid problem of pad co-planarity, oxidation and damage of PC board after de-soldering comparing to conventional design, Provide protection to PC board from cutting through by probes.
- "Buy and use" modular design makes it no needs customer to provide PC board, protect customer's IP.
- Standaridized design simplify processing,save cost and shorten lead time. 3 ~ 4 days since PO received to product delivery.
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Mechanical
Socket Body: Peek Ceramic
Socket Lid: AL,Cu,POM
Contact: Spring Probe
Solder Ball: RoHS Compliant(Lead-free) 96.5Sn/3.0Ag/0.5Cu(SAC305)
Operation Temperature: -40ºC to 140ºC
Life Span at Operating Travel:100K cycles Min.
Cycles Spring Force: 20g ~ 30g per Pin
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Electrical
Current Rating (Continuous) : 1A Min.
DC Resistance: 100mohm Max.
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- Solder F interposer to PC board
- Attach Socket using four supplied screws
- Insert Device by hand or with the aid of a vacuum pen(recommened)
- Place and lock Lid, screw down heat sink actuator for device engagement
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Packaging Details
Unit Type:
piece
Package Weight:
0.500kg (1.10lb.)
Package Size:
12cm x 11cm x 9cm (4.72in x 4.33in x 3.54in)