Item specifics

Model Number:

703-0000094

Brand Name:

SIREDA

is_customized:

Yes

Package:

BGA

Pitch:

0.5mm

Pin Count:

221

IC Size:

11.5X13mm

Structure:

Clamshell

Contact:

Spring Probe

Product Description

BGA221(eMCP) Socket USB Solution_11.5X13mm Perform,eMCP Socket, eMCP adapter

The USB solution is designed for test, debug, validation, and programming of eMMC, eMCP devices

The USB solution provides a compact test solution for eMMC, eMCP devices used in applications such as handheld, mobile, and TV product development. 

 

• Test, debug, validation, and programming of  eMMC, eMCP devices
• Failure analysis / System and wafer test
• Package and Chip qualification
• Production prototype / Data recover

 

 

 

 

 

• Suitable for devices of  Samsung, Hynix, Sandisk, Toshiba, Intel, Kingston etc eMMC and eMCP.
• Support eMMC version: ≤eMMC5.0.
• Support hot plug, eMMC can be directly connected to PC with USB 3.0 port.
• Realize reading, accessing and writting data for eMMC and eMCP devices
   

 

Mechanical Socket Body: PPS Socket Lid: Aluminum Alloy Contact: Spring Probe Operation Temperature: 0ºC to 80ºC Life Span at Operating Travel:50K Cycles min. Cycles Spring Force:24.5gf per Pin	Electrical Current Rating (Continuous) : 2A DC Resistance: 100mohm

 

 

Place a Device by hand on to the socket. Lock the lid. Connect to PC by USB port. Now it is ready for use.

 

 

Packaging Details

Unit Type:

piece

Package Weight:

0.500kg (1.10lb.)

Package Size:

12cm x 11cm x 9cm (4.72in x 4.33in x 3.54in)