EVG510晶圆键合机

EVG510晶圆键合机
型号：EVG®510
品牌：EVG
原产地：奥地利
类别：电子、电力 / 其它电力、电子
标签︰晶圆键合机 , EVG晶圆键合机 , 永久键合机
单价： €680000 / 件
最少订量：1 件
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产品描述

Features

  • Unique pressure and temperature uniformity
  • Compatible with EVG mechanical and optical aligners
  • Flexible design and configurations for research and piloting
    • Form single chips to wafers
    • Various processes (eutectic, solder, TLP, direct bonding)
    • Optional turbopump (<1E-5 mbar)
    • Upgradeable for anodic bonding
    • Open chamber design for easy conversion and maintenance
  • Production compatible
    • High throughput with fast heating and pumping specifications
    • High yield through automatic wedge compensation
    • Open chamber design for fast conversion and maintenance
    • Smallest footprint for a 200 mm bonding system: 0.8 m2
    • Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems

Technical Data

Max contact force
10, 20, 60 kN
Heater size 150 mm 200 mm
Minimum substrate dimension single chips 100 mm
Vacuum
Standard: 0.1 mbar
Optional: 1E-5 mbar
Max. temperature
Standard: 550 °C
Optional: 650 °C
Single chips processing
Yes
Bond chuck system / Alignment system
150 mm heater: EVG®610, EVG®620, EVG®6200
200 mm heater: EVG®6200, SmartView® NT
Active water cooling
For bottom side
Power supply for anodic bonding
Max. voltage: 2 kV
Max. current: 50 mA
Loading chamber
Manual
EVG510晶圆键合机 1

会员信息

上海螣芯电子科技有限公司
国家/地区︰上海市闵行区
经营性质︰贸易商
联系电话︰13122976482
联系人︰娄先生 (销售总监)
最后上线︰2023/08/14
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