EVG510晶圓鍵合機
| 型號： | EVG®510 |
|---|---|
| 品牌： | EVG |
| 原產地： | 奧地利 |
| 類別： | 電子、電力 / 其它電力、電子 |
| 標籤︰ | 晶圓鍵合機 , EVG晶圓鍵合機 , 永久鍵合機 |
| 單價： |
€680000
/ 件
|
| 最少訂量： | 1 件 |
產品描述
Features
- Unique pressure and temperature uniformity
- Compatible with EVG mechanical and optical aligners
- Flexible design and configurations for research and piloting
- Form single chips to wafers
- Various processes (eutectic, solder, TLP, direct bonding)
- Optional turbopump (<1E-5 mbar)
- Upgradeable for anodic bonding
- Open chamber design for easy conversion and maintenance
- Production compatible
- High throughput with fast heating and pumping specifications
- High yield through automatic wedge compensation
- Open chamber design for fast conversion and maintenance
- Smallest footprint for a 200 mm bonding system: 0.8 m2
- Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems
Technical Data
| Max contact force |
|---|
| 10, 20, 60 kN |
| Heater size | 150 mm | 200 mm |
|---|---|---|
| Minimum substrate dimension | single chips | 100 mm |
| Vacuum |
|---|
| Standard: 0.1 mbar |
| Optional: 1E-5 mbar |
| Max. temperature |
|---|
| Standard: 550 °C |
| Optional: 650 °C |
| Single chips processing |
|---|
| Yes |
| Bond chuck system / Alignment system |
|---|
| 150 mm heater: EVG®610, EVG®620, EVG®6200 |
| 200 mm heater: EVG®6200, SmartView® NT |
| Active water cooling |
|---|
| For bottom side |
| Power supply for anodic bonding |
|---|
| Max. voltage: 2 kV |
| Max. current: 50 mA |
| Loading chamber |
|---|
| Manual |
會員信息
| 上海螣芯電子科技有限公司 | |
|---|---|
| 國家/地區︰ | 上海市闵行区 |
| 經營性質︰ | 貿易商 |
| 聯繫電話︰ | 13122976482 |
| 聯繫人︰ | 婁先生 (銷售總監) |
| 最後上線︰ | 2023/08/14 |
